進接式或是接觸式曝光的缺點是在使用後在光罩上會產生光罩汙染,致使良率降低與曝光解析度便壞。AS/AF光罩保護鍍膜可以解決此問題。AS/AF鍍膜不僅可增長使用壽命同時可使解析度增加至5um。
鉻膜光罩在接觸式長時間使用後,摩擦造成的靜電常致使鉻膜電擊爆裂。因此抗靜電AS/AF鍍膜是不僅可解決靜電問題也可以增強耐刮使用問題。

AS/AF光罩鍍膜(AS/AF mask coating)



ESD/AS 光罩鍍膜(ESD/AS mask coating)
Applications:
Cr-mask usually suffers ESD(electro-static discharge) issue after long time friction between mask and exposed substrate. This ESD can be released by using conductive AS/AF coating offered by Cti unique technology.
Fluorinated SiOx ESD material materials was coated on mask using slit or spin coating that will successfully dissipate ESD to <800V and safe mask from Cr-pattern broken.
Specifications: ESD <800V after 100times attach and release from substrates.
■ Process: mask cleaning, then spin or slit coating Fluorinated resin on mask, finally oven baking to secure its reliability.  Defect control: >5um of particle and with AOI scanning capability of 5um.

複製光罩及黑色光阻光罩
玻璃Black 光阻基板及光罩
應用領域: 取代現有玻璃乳膠光罩(emulsion mask),以及低成本的film 乳膠光罩。
比較光罩底片及使用品質:
Specification: black Carbon film 1.5um, OD=3.8 與鉻膜一樣
製程解析力可達10um, 較現況日本乳膠優
冠橙碳黑材料製程特性: 高塗佈均勻性、高感度、高附著、較大顯影製程窗口
可靠度: 高耐熱性、高耐光性、高耐化性、高儲存安定性。
使用Cti碳黑底片效益(除品質外)
是綠色環保物質,遠比鹵化銀重金屬佳
鹵化銀底片已過時材料,使用碳黑可以較易使用。

Applications:
mask using contact and proximity printing, with this overcoat film masks are greatly reduced particle contamination in hard and vacuum contact, which resulting mask lifetime increase..
PCB emulsion mask, where feature sizes are 10 to 40um, AS_mask will improve yield, because mask and substrate do not risk contact. However, where gaps are sometimes reduced to 30 microns in order to pattern 10um   features, AS_mask is expected to help maintain the high process yield of small gaps.
Process: mask cleaning, then spin or slit coating Fluorinated resin on mask, finally oven baking to secure its reliability.  Defect control: >5um of particle and with AOI scanning capability of 5um.